Nā huahana
4 papa pcb me ka manamana gula ma ka ʻōnaehana leo kikohoʻe
| Nā ʻāpana | 4 papa |
| Mānoanoa papa | 1.60MM |
| Mea waiwai | FR4 tg150 |
| Ka mānoanoa keleawe | 1 OZ(35um) |
| Hoʻopau ʻili | ENIG Au Mānoanoa 1um;Ni Mānoanoa 3um |
| Puka min(mm) | 0.203mm |
| Laina Laina min (mm) | 0.15mm |
| Mokuna laina min(mm) | 0.15mm |
| Palekana Solder | ʻōmaʻomaʻo |
| Kala Kaao | Keʻokeʻo |
| Ka hana mīkini | V-scoring, CNC Milling (alanui) |
| Hoʻopili | ʻeke anti-static |
| E-hoʻāʻo | ʻO ka ʻimi lele ʻana a i ʻole ka mea paʻa |
| Kūlana ʻae | IPC-A-600H Papa 2 |
| Palapala noi | Mea uila kaʻa |
Mea Huahana
Ma keʻano he mea hoʻolako i nāʻenehana PCB likeʻole, nā puke, nā koho manawa alakaʻi, loaʻa iā mākou kahi koho o nā mea maʻamau me kahi bandwidth nui o nāʻano likeʻole o ka PCB hiki ke uhiʻia a loaʻa mau i ka hale.
Hiki ke hoʻokō ʻia nā koi no nā mea ʻē aʻe a i ʻole nā mea kūikawā i ka nui o nā hihia, akā, ma muli o nā koi pololei, a hiki i kahi 10 mau lā hana e pono ai ke kūʻai i ka mea.
E hui pū me mākou a kūkākūkā i kāu mau pono me kekahi o kā mākou kūʻai a i ʻole hui CAM.
Nā mea maʻamau i mālama ʻia i ka waihona:
| Nā ʻāpana | mānoanoa | Hoʻomanawanui | ʻAno ulana |
| Nā papa o loko | 0,05mm | +/-10% | 106 |
| Nā papa o loko | 0.10mm | +/-10% | 2116 |
| Nā papa o loko | 0,13mm | +/-10% | 1504 |
| Nā papa o loko | 0,15mm | +/-10% | 1501 |
| Nā papa o loko | 0.20mm | +/-10% | 7628 |
| Nā papa o loko | 0,25mm | +/-10% | 2 x 1504 |
| Nā papa o loko | 0.30mm | +/-10% | 2 x 1501 |
| Nā papa o loko | 0.36mm | +/-10% | 2 x 7628 |
| Nā papa o loko | 0,41mm | +/-10% | 2 x 7628 |
| Nā papa o loko | 0,51mm | +/-10% | 3 x 7628/2116 |
| Nā papa o loko | 0,61mm | +/-10% | 3 x 7628 |
| Nā papa o loko | 0.71mm | +/-10% | 4 x 7628 |
| Nā papa o loko | 0,80mm | +/-10% | 4 x 7628/1080 |
| Nā papa o loko | 1,0mm | +/-10% | 5 x7628/2116 |
| Nā papa o loko | 1,2mm | +/-10% | 6 x7628/2116 |
| Nā papa o loko | 1,55mm | +/-10% | 8 x7628 |
| Prepregs | 0.058mm* | Pili i ka hoʻolālā | 106 |
| Prepregs | 0.084mm* | Pili i ka hoʻolālā | 1080 |
| Prepregs | 0.112mm* | Pili i ka hoʻolālā | 2116 |
| Prepregs | 0.205mm* | Pili i ka hoʻolālā | 7628 |
ʻO ka mānoanoa Cu no nā papa o loko: Kūlana - 18µm a me 35 µm,
ma ke noi 70 µm, 105µm a me 140µm
ʻAno mea: FR4
Tg: ma kahi o.150°C, 170°C, 180°C
εr ma 1 MHz: ≤5,4 (maʻamau: 4,7) Loaʻa hou aku ma ke noi
Hoʻopili
ʻO ka papa kaapuni paʻi paʻi 4 he 3 o nā papa hoʻokahi a me kahi papa honua e hana ana i 4 mau papa i ka huina.
Hoʻohana ʻia kēia mau papa a pau no ke ala ʻana i nā hōʻailona.
Aia nā ʻauʻau ʻelua ʻelua i loko o ke kumu a hoʻohana pinepine ʻia e like me nā pane mana a i ʻole i kapa ʻia ʻo ke ala ʻana o nā hōʻailona.
ʻO ka ʻōlelo wale ʻana he 4-layer PCB stackup aia ka 2 o ka singlea VCC a me kahi papa honua.
Nā mea nui no ke kūʻai ʻana i ka pcb
ʻO ka hapa nui o nā mea kūʻai uila uila ua huikau e pili ana i ke kumukūʻai o nā PCB.ʻO kekahi poʻe me nā makahiki he nui o ka ʻike i ka kūʻai ʻana PCB ʻaʻole maopopo i ke kumu kumu.ʻO ka ʻoiaʻiʻo, ʻo ke kumukūʻai PCB ka mea i haku ʻia i kēia mau mea:
ʻO ka mea mua, ʻokoʻa nā kumukūʻai ma muli o nā mea like ʻole i hoʻohana ʻia i ka PCB.
ʻO ka lawe ʻana i nā papa pālua maʻamau pcb ma ke ʻano he laʻana, ʻokoʻa ka laminate mai FR-4, CEM-3, a pēlā aku me nā pae mānoanoa mai 0.2mm a 3.6mm.ʻOkoʻa ka mānoanoa o ke keleawe mai ka 0.5Oz a i ka 6Oz, ʻo ia mau mea a pau ke kumu kūʻai nui loa.ʻOkoʻa nā kumukūʻai inika soldermask mai nā mea inika thermosetting maʻamau a me nā mea inika ʻōmaʻomaʻo photosensitive.
ʻO ka lua, ʻokoʻa nā kumukūʻai ma muli o nā kaʻina hana like ʻole.
ʻO nā kaʻina hana hana like ʻole ka hopena i nā kumukūʻai like ʻole.E like me ka papa gula a me ka papa tin-plated, ke ʻano o ke alahele a me ke kuʻi ʻana, ka hoʻohana ʻana i nā laina pale siliki a me nā laina kiʻiʻoniʻoni maloʻo e hana i nā kumukūʻai like ʻole, e hopena i ka ʻokoʻa kumukūʻai.
