Ma ANKE PCB, ʻike nā lawelawe PCB maʻamau i nā lawelawe hana hana papa kaapuni paʻi piha.Me nā makahiki he 10 ʻO ka ʻike hana PCBs, ua lawelawe mākou mau kaukani o nā papahana PCB e uhi ana i kēlā me kēia ʻano mea substrate me FR4, Aluminum, Rogers a me nā mea hou aku.ʻO kēia ʻaoʻao e pili ana i nā PCB maʻamau FR4.No nā PCB me nā substrate ʻenehana kūikawā, e ʻoluʻolu e nānā i nā ʻaoʻao pūnaewele pili no ka ʻike a i ʻole e ʻoluʻolu e waiho iā mākou i ka leka uila mainfo@anke-pcb.com.
ʻOkoʻa me ka pcb sampling, ʻoi aku ka maikaʻi o ka hana ʻana o ka PCB maʻamau a ʻoi aku ka maikaʻi o ka hana paʻa.
Paipai ʻia nā lawelawe PCB maʻamau ke mākaukau kāu hoʻolālā e hoʻololi mai ka prototype i ka hana.Hiki iā mākou ke hana i 10 miliona mau PCB kiʻekiʻe i nā lā 2 wale nō.No ka hāʻawi ʻana i kāu papahana i ka hana i makemake ʻia a me nā mea hou aku, hāʻawi mākou i nā hiʻohiʻona holomua no nā lawelawe PCB maʻamau.Hōʻike ʻia ka mana piha e like me lalo:
Ka Mana Loa
| Hiʻona | Ka hiki |
| Papa maikaʻi | IPC maʻamau 2 |
| Ka helu o na papa | 1 -42 papa |
| Ka nui kauohay | 1pc - 10,000,000 pcs |
| Ka manawa o waena o ka hoʻomaka a i ka wā pau | 1 lā - 5 mau pule (Ka lawelawe wikiwiki) |
| Mea waiwai | FR-4 Tg 150°C, FR4-Kiekie Tg 170°C, FR4-Kiekie-Tg180°C,FR4-Halogen-noa, FR4-Halogen-noa & Ki'eki'e-Tg |
| Nui o ka Papa | 610*1100mm |
| ʻO ka ʻae ʻana i ka nui o ka papa | ±0.1mm - ±0.3mm |
| Mānoanoa Papa | 0.2-0.65mm |
| Hoʻomanawanui Papa Mānoanoa | ±0.1mm - ±10% |
| Kaumaha keleawe | 1-6OZ |
| Kauona keleawe o loko | 1-4OZ |
| Hoʻomanawanui mānoanoa keleawe | +0μm +20μm |
| Min Huli/Spacing | 3mil/3mil |
| Nā ʻaoʻao huna huna | E like me ka faila |
| Kalai Makani Solder | ʻOmaomao, Keʻokeʻo, Polū, ʻEleʻele, ʻulaʻula, Melemele |
| Silkscreen aoao | E like me ka faila |
| Kala Silkscreen | Keʻokeʻo, ʻulaʻula, ʻeleʻele, ʻulaʻula, melemele |
| Hoʻopau ʻili | HASL - Hoʻokiʻekiʻe i ka ea wela Ke alakaʻi manuahi HASL - RoHS ENIG - Nickle Uila ʻole/Gala Kaiapuni - RoHS ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS Kālā Immersion - RoHS Pahu Kaiapuni - RoHS OSP -Organic Solderability Preservatives - RoHS Kāleka gula koho, mānoanoa gula a hiki i 3um(120u”) |
| Min Annular Ring | 3mil |
| Min wili lua anawaena | 6mil, 4mil-laser drill |
| Min Laulā o ka ʻoki ʻoki (NPTH) | Min Laulā o ka ʻoki ʻoki (NPTH) |
| NPTH Hole Nui Ke ahonui | ±.002" (±0.05mm) |
| Min Laulā o ka Puka Slot (PTH) | 0.6mm |
| PTH Hole Nui Ke ahonui | ±.003" (±0.08mm) - ±4mil |
| Ka Ili | 20μm - 30μm |
| Hoʻomanawanui SM (LPI) | 0.003" (0.075mm) |
| ʻAspect Ratio | 1.10 (nui puka: mānoanoa papa) |
| Hoao | 10V - 250V, ʻimi lele a i ʻole mea hoʻāʻo |
| Ka hoʻomanawanui impedance | ±5% - ±10% |
| SMD Pitch | 0.2mm(8mil) |
| BGA Pitch | 0.2mm(8mil) |
| Chamfer o nā manamana gula | 20, 30, 45, 60 |
| Nā ʻenehana ʻē aʻe | Nā manamana gula Makapo a kanu ʻia peelable solder mask Hoʻopalapala lihi Palekana Kalapona Kapton lipine Puka countersink/counterbore Puka hapa ʻoki/Castellated Puka kūpono Via hale lole/uhi me ka resin Via plugged/hoʻopiha ʻia me ka resin Via ma ka papa Hoao Uila |
