Kaʻina hana hana
Ma hope o ka mea i wae 'ia, mai ka hana kaʻina hana e hoʻomalu i ka sliding pā a me ka sanwiti pā e lilo i oi aku nui. No ka hoʻonui i ka helu o ka kulou ana, pono pono ka mana i ka wā e hana kaumaha uila keleawe process.General ka mea i koi 'ia o ke ola no ka sliding papa a me ka multilayer layered plate, ʻo ka ʻoihana kelepona kelepona maʻamau ka liʻiliʻi liʻiliʻi a hiki i 80000 mau manawa.
No ka FPC apono i ke kaʻina hana maʻamau no ka papa holoʻokoʻa kaʻina hana, like paakiki ma hope o ka tram kiʻi, no laila, i loko o ke keleawe plating 'aʻole pono loa thickly plated keleawe mānoanoa, ili keleawe ma 0.1 ~ 0.3 mil mea pono loa.(ma ke keleawe plating. o ke keleawe a me ke keleawe deposition lākiō mea e pili ana i 1: 1) akā, i mea e hōʻoia i ka maikaʻi o ka lua keleawe a me ka SMT puka keleawe a me ke kumu mea ma kiʻekiʻe wela stratification, a kau ma luna o ka uila conductivity o ka huahana a me ka kamaʻilio, keleawe mānoanoa degere koi. ʻo 0.8 ~ 1.2 mil a i ʻole.
Ma keia hihia hiki ke hele mai i ka pilikia, malia paha e ninau mai kekahi, ili keleawe koi mea wale 0.1 ~ 0.3 mil, a (aohe keleawe substrate) puka keleawe koi ma 0.8 ~ 1.2 mil?Pehea ʻoe i hana ai? Pono kēia e hoʻonui i ke kaʻina hana holoʻokoʻa o ka papa FPC (inā makemake wale ʻo 0.4 ~ 0.9 mil) plating no ka: ʻoki ʻana a me ka ʻeli ʻana i ka pā keleawe (nā lua ʻeleʻele), ke keleawe uila (0,4 ~ 0,9 mil) - kiʻi - ma hope o ka hana.
E like me ke koi o ka mākeke uila no nā huahana FPC a ʻoi aku ka ikaika, no ka FPC, ka pale ʻana o ka huahana a me ka hana o ka ʻike pilikino o ka maikaʻi o ka huahana i nā hopena koʻikoʻi ma ka nānā hope ʻana ma o ka mākeke, ʻoi aku ka maikaʻi o ka huahana i ka hana hana a me ka huahana. ʻO kekahi o ke kaumaha nui o ka hoʻokūkū papa kaapuni paʻi.
Ka manawa hoʻouna: Iune-25-2022
