Hiki ke hoʻouna
Kaha papa ʻoʻoleʻa | |
Ka helu o nā papa: | 1-42 papa |
Material: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers |
Ka mānoanoa o waho Cu: | 1-6OZ |
ʻO ka mānoanoa Cu ka mānoanoa o loko: | 1-4OZ |
ʻāpana hana kiʻekiʻe loa: | 610*1100mm |
Mānoanoa papa liʻiliʻi: | 2 papa 0.3mm (12mil) 4 papa 0.4mm (16mil) 6 papa 0.8mm (32mil) 8 papa 1.0mm (40mil) 10 papa 1.1mm (44mil) 12 papa 1.3mm (52mil) 14 papa 1.5mm (59mil) 16 papa 1.6mm (63mil) |
Laulā liʻiliʻi: | 0.076mm (3mil) |
Wahi liʻiliʻi loa: | 0.076mm (3mil) |
Ka nui o ka puka liʻiliʻi (puka hope): | 0.2mm |
Lakiō hiʻohiʻona: | 10:1 |
Ka nui o ka lua wili: | 0.2-0.65mm |
ʻO ka hoʻomanawanui wili ʻana: | +\-0.05mm(2mil) |
PTH hoʻomanawanui: | Φ0.2-1.6mm +\-0.075mm (3mil) Φ1.6-6.3mm+\-0.1mm(4mil) |
NPTH hoʻomanawanui: | Φ0.2-1.6mm +\-0.05mm(2mil) Φ1.6-6.3mm+\-0.05mm(2mil) |
Hoʻopau papa hoʻomanawanui: | Mānoanoa <0.8mm, Hoʻomanawanui:+/-0.08mm |
0.8mm≤Thickness≤6.5mm,Hoʻomanawanui+/-10% | |
Alahaka soldermask liʻiliʻi: | 0.076mm (3mil) |
ʻO ka wili a me ka piko: | ≤0.75% Min0.5% |
Raneg o TG: | 130-215 ℃ |
Ka hoʻomanawanui impedance: | +/-10%,Min+/-5% |
Lapaʻau ʻili:
| HASL, LF HASL |
Gula Kaiapuni, gula Flash, manamana gula | |
Kālā Immersion, Tin Immersion, OSP | |
Kāleka gula koho, mānoanoa gula a hiki i 3um(120u”) | |
Paʻi Kalapona, Peelable S/M, ENEPIG | |
Kaha papa alumini | |
Ka helu o nā papa: | Papa hoʻokahi, papa ʻelua |
Nui ka nui o ka papa: | 1500*600mm |
Mānoanoa papa: | 0.5-3.0mm |
Ka mānoanoa keleawe: | 0.5-4oz |
Ka nui o ka puka liʻiliʻi: | 0.8mm |
laula liʻiliʻi: | 0.1mm |
wahi liʻiliʻi loa: | 0.12mm |
Ka nui o ka papa liʻiliʻi: | 10 micron |
Pau ʻili: | HASL, OSP, ENIG |
Hana ʻana: | CNC, Kuʻi, V-ʻoki |
Mea lako: | Mea hoʻokolo honua |
ʻO ka ʻimi lele ʻana i ka wehe/ka mea hōʻike pōkole | |
Microscope mana kiʻekiʻe | |
Kiko ho'āʻo Solderability | |
Mea ho'āʻo ikaika Peel | |
High Volt Open & Pōkole hōʻike | |
Kea Pauku Molding Kit Me ka Polisher | |
Kaha FPC | |
Nā ʻāpana: | 1-8 papa |
Mānoanoa papa: | 0.05-0.5mm |
Ka mānoanoa keleawe: | 0.5-3OZ |
Laulā liʻiliʻi: | 0.075mm |
wahi liʻiliʻi loa: | 0.075mm |
Ka nui o loko o ka puka: | 0.2mm |
Ka nui o ka puka laser liʻiliʻi: | 0.075mm |
Ka liʻiliʻi loa o ka puka kuʻi: | 0.5mm |
ʻO ke ahonui Soldermask: | +\-0.5mm |
ʻO ka liʻiliʻi o ka ʻae ʻana i ke ana ʻana: | +\-0.5mm |
Pau ʻili: | HASL,LF HASL, Kālā Kaiapuni, Gula Kaiapuni, Gula Flash, OSP |
Hana ʻana: | Kuʻi, Laser, ʻoki |
Mea lako: | Mea hoʻokolo honua |
ʻO ka ʻimi lele ʻana i ka wehe/ka mea hōʻike pōkole | |
Microscope mana kiʻekiʻe | |
Kiko ho'āʻo Solderability | |
Mea ho'āʻo ikaika Peel | |
High Volt Open & Pōkole hōʻike | |
Kea Pauku Molding Kit Me ka Polisher | |
ʻO ka mana ʻoi aʻe | |
Nā ʻāpana: | 1-28 papa |
ʻAno mea: | FR-4(Kiʻekiʻe Tg, Halogen Free, Kiʻekiʻe alapinepine) PTFE, BT, Getek, Aluminum base,Copper base,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
Mānoanoa papa: | 6-240mil/0.15-6.0mm |
Ka mānoanoa keleawe: | 210um (6oz) no ka papa loko 210um (6oz) no ka papa waho |
ʻO ka nui o ka drill mechanical min: | 0.2mm/0.08” |
Lakiō hiʻohiʻona: | 2:1 |
Nui ka nui o ka panel: | ʻO ka ʻaoʻao Sigle a i ʻole ʻaoʻao pālua: 500mm * 1200mm |
Nā ʻāpana ʻāpana he nui: 508mm X 610mm (20″ X 24″) | |
Min laula laina/wāwae: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
Via ʻano puka: | Makapō / Kanu / Hoʻopili (VOP, VIP…) |
HDI / Microvia: | ʻAE |
Pau ʻili: | HASL, LF HASL |
Gula Kaiapuni, gula Flash, manamana gula | |
Kālā Immersion, Tin Immersion, OSP | |
Kāleka gula koho, mānoanoa gula a hiki i 3um(120u”) | |
Paʻi Kalapona, Peelable S/M, ENEPIG | |
Hana ʻana: | CNC, Kuʻi, V-ʻoki |
Mea lako: | Mea hoʻokolo honua |
ʻO ka ʻimi lele ʻana i ka wehe/ka mea hōʻike pōkole | |
Microscope mana kiʻekiʻe | |
Kiko ho'āʻo Solderability | |
Mea ho'āʻo ikaika Peel | |
High Volt Open & Pōkole hōʻike | |
Kea Pauku Molding Kit Me ka Polisher |