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kaha PCB

Hiki ke hoʻouna

Kaha papa ʻoʻoleʻa
Ka helu o nā papa: 1-42 papa
Material: FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers
Ka mānoanoa o waho Cu: 1-6OZ
ʻO ka mānoanoa Cu ka mānoanoa o loko: 1-4OZ
ʻāpana hana kiʻekiʻe loa: 610*1100mm
Mānoanoa papa liʻiliʻi: 2 papa 0.3mm (12mil)

4 papa 0.4mm (16mil)

6 papa 0.8mm (32mil)

8 papa 1.0mm (40mil)

10 papa 1.1mm (44mil)

12 papa 1.3mm (52mil)

14 papa 1.5mm (59mil)

16 papa 1.6mm (63mil)

Laulā liʻiliʻi: 0.076mm (3mil)
Wahi liʻiliʻi loa: 0.076mm (3mil)
Ka nui o ka puka liʻiliʻi (puka hope): 0.2mm
Lakiō hiʻohiʻona: 10:1
Ka nui o ka lua wili: 0.2-0.65mm
ʻO ka hoʻomanawanui wili ʻana: +\-0.05mm(2mil)
PTH hoʻomanawanui: Φ0.2-1.6mm +\-0.075mm (3mil)

Φ1.6-6.3mm+\-0.1mm(4mil)

NPTH hoʻomanawanui: Φ0.2-1.6mm +\-0.05mm(2mil)

Φ1.6-6.3mm+\-0.05mm(2mil)

Hoʻopau papa hoʻomanawanui: Mānoanoa <0.8mm, Hoʻomanawanui:+/-0.08mm
0.8mm≤Thickness≤6.5mm,Hoʻomanawanui+/-10%
Alahaka soldermask liʻiliʻi: 0.076mm (3mil)
ʻO ka wili a me ka piko: ≤0.75% Min0.5%
Raneg o TG: 130-215 ℃
Ka hoʻomanawanui impedance: +/-10%,Min+/-5%
Lapaʻau ʻili:

 

HASL, LF HASL
Gula Kaiapuni, gula Flash, manamana gula
Kālā Immersion, Tin Immersion, OSP
Kāleka gula koho, mānoanoa gula a hiki i 3um(120u”)
Paʻi Kalapona, Peelable S/M, ENEPIG
                              Kaha papa alumini
Ka helu o nā papa: Papa hoʻokahi, papa ʻelua
Nui ka nui o ka papa: 1500*600mm
Mānoanoa papa: 0.5-3.0mm
Ka mānoanoa keleawe: 0.5-4oz
Ka nui o ka puka liʻiliʻi: 0.8mm
laula liʻiliʻi: 0.1mm
wahi liʻiliʻi loa: 0.12mm
Ka nui o ka papa liʻiliʻi: 10 micron
Pau ʻili: HASL, OSP, ENIG
Hana ʻana: CNC, Kuʻi, V-ʻoki
Mea lako: Mea hoʻokolo honua
ʻO ka ʻimi lele ʻana i ka wehe/ka mea hōʻike pōkole
Microscope mana kiʻekiʻe
Kiko ho'āʻo Solderability
Mea ho'āʻo ikaika Peel
High Volt Open & Pōkole hōʻike
Kea Pauku Molding Kit Me ka Polisher
                         Kaha FPC
Nā ʻāpana: 1-8 papa
Mānoanoa papa: 0.05-0.5mm
Ka mānoanoa keleawe: 0.5-3OZ
Laulā liʻiliʻi: 0.075mm
wahi liʻiliʻi loa: 0.075mm
Ka nui o loko o ka puka: 0.2mm
Ka nui o ka puka laser liʻiliʻi: 0.075mm
Ka liʻiliʻi loa o ka puka kuʻi: 0.5mm
ʻO ke ahonui Soldermask: +\-0.5mm
ʻO ka liʻiliʻi o ka ʻae ʻana i ke ana ʻana: +\-0.5mm
Pau ʻili: HASL,LF HASL, Kālā Kaiapuni, Gula Kaiapuni, Gula Flash, OSP
Hana ʻana: Kuʻi, Laser, ʻoki
Mea lako: Mea hoʻokolo honua
ʻO ka ʻimi lele ʻana i ka wehe/ka mea hōʻike pōkole
Microscope mana kiʻekiʻe
Kiko ho'āʻo Solderability
Mea ho'āʻo ikaika Peel
High Volt Open & Pōkole hōʻike
Kea Pauku Molding Kit Me ka Polisher

ʻO ka mana ʻoi aʻe

Nā ʻāpana: 1-28 papa
ʻAno mea: FR-4(Kiʻekiʻe Tg, Halogen Free, Kiʻekiʻe alapinepine)

PTFE, BT, Getek, Aluminum base,Copper base,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon

Mānoanoa papa: 6-240mil/0.15-6.0mm
Ka mānoanoa keleawe: 210um (6oz) no ka papa loko 210um (6oz) no ka papa waho
ʻO ka nui o ka drill mechanical min: 0.2mm/0.08”
Lakiō hiʻohiʻona: 2:1
Nui ka nui o ka panel: ʻO ka ʻaoʻao Sigle a i ʻole ʻaoʻao pālua: 500mm * 1200mm
Nā ʻāpana ʻāpana he nui: 508mm X 610mm (20″ X 24″)
Min laula laina/wāwae: 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil
Via ʻano puka: Makapō / Kanu / Hoʻopili (VOP, VIP…)
HDI / Microvia: ʻAE
Pau ʻili: HASL, LF HASL
Gula Kaiapuni, gula Flash, manamana gula
Kālā Immersion, Tin Immersion, OSP
Kāleka gula koho, mānoanoa gula a hiki i 3um(120u”)
Paʻi Kalapona, Peelable S/M, ENEPIG
Hana ʻana: CNC, Kuʻi, V-ʻoki
Mea lako: Mea hoʻokolo honua
ʻO ka ʻimi lele ʻana i ka wehe/ka mea hōʻike pōkole
Microscope mana kiʻekiʻe
Kiko ho'āʻo Solderability
Mea ho'āʻo ikaika Peel
High Volt Open & Pōkole hōʻike
Kea Pauku Molding Kit Me ka Polisher