Nā huahana
Industrial sensor 4 papa paakiki & flex pcb me 2oz keleawe
| Nā ʻāpana | 4 papa ʻoʻoleʻa + 2 papa flex |
| Mānoanoa papa | 1.60MM+0.2mm |
| Mea waiwai | FR4 tg150+Polymide |
| Ka mānoanoa keleawe | 1 OZ(35um) |
| Hoʻopau ʻili | ENIG Au Mānoanoa 1um;Ni Mānoanoa 3um |
| Puka min(mm) | 0.21mm |
| Laina Laina min (mm) | 0.15mm |
| Mokuna laina min(mm) | 0.15mm |
| Palekana Solder | ʻōmaʻomaʻo |
| Kala Kaao | Keʻokeʻo |
| Ka hana mīkini | V-scoring, CNC Milling (alanui) |
| Hoʻopili | ʻeke anti-static |
| E-hoʻāʻo | ʻO ka ʻimi lele ʻana a i ʻole ka mea paʻa |
| Kūlana ʻae | IPC-A-600H Papa 2 |
| Palapala noi | Mea uila kaʻa |
Hoʻolauna
Hoʻohui ʻia nā pcbs Rigid&flex me nā papa ʻoʻoleʻa e hana i kēia huahana hybrid.Aia kekahi mau papa o ke kaʻina hana i kahi kaapuni maʻalahi e holo ana ma nā papa paʻa, e like me
he hoʻolālā kaapuni paʻakikī maʻamau.
Na ka mea hoʻolālā papa e hoʻohui i nā lua i hoʻopaʻa ʻia (PTH) e hoʻopili ai i nā kaapuni ʻoʻoleʻa a maʻalahi ma ke ʻano o kēia kaʻina hana.Ua kaulana kēia PCB ma muli o kona naʻauao, pololei, a me ka maʻalahi.
Hoʻomaʻamaʻa nā PCB Rigid-Flex i ka hoʻolālā uila ma o ka wehe ʻana i nā uwea maʻalahi, nā pilina, a me nā uwea pilikino.ʻOi aku ka paʻa o ka papa kaapuni Rigid&Flex i loko o ka hoʻolālā holoʻokoʻa o ka papa, kahi e hoʻomaikaʻi ai i ka hana uila.
Hiki i nā ʻenekinia ke manaʻo e ʻoi aku ka maikaʻi o ka mālama ʻana a me ka hana uila e hoʻomaikaʻi ʻia i nā pili uila a me ka mīkini paʻa PCB.
Mea waiwai
Nā mea lepo
ʻO ka mea kaulana loa ʻo rigid-ex ka fiberglass i ulana ʻia.ʻO kahi papa mānoanoa o ka epoxy resin ka uhi i kēia fiberglass.
Akā naʻe, ʻaʻole maopopo ka fiberglass epoxy-impregnated.ʻAʻole hiki iā ia ke pale i nā haʻalulu paʻa a paʻa.
Polyimide
Ua koho ʻia kēia mea no kona maʻalahi.He paʻa a hiki ke pale i nā haʻalulu a me nā neʻe.
Hiki i ka Polyimide ke pale i ka wela.He kūpono kēia no nā noi me nā loli wela.
Polyester (PET)
Makemake ʻia ʻo PET no kāna mau hiʻohiʻona uila a me ka maʻalahi.Kūʻē ia i nā kemika a me ka wai.No laila hiki ke hoʻohana ʻia i nā kūlana ʻoihana paʻakikī.
ʻO ka hoʻohana ʻana i kahi substrate kūpono e hōʻoia i ka ikaika a me ka lōʻihi i makemake ʻia.Manaʻo ʻo ia i nā mea e like me ke kūpaʻa wela a me ke kūpaʻa ʻana i ke ana i ke koho ʻana i kahi substrate.
Polyimide Adhesives
ʻO ka elasticity wela o kēia mea hoʻopili i mea kūpono no ka hana.Hiki iā ia ke kū i 500°C.ʻO kona kūpaʻa wela kiʻekiʻe e kūpono ia no nā ʻano hana koʻikoʻi.
Polyester Adhesives
ʻOi aku ka mālama ʻana o kēia mau mea hoʻopili ma mua o ka polyimide adhesives.
Maikaʻi lākou no ka hana ʻana i nā kaapuni pahū pahū maʻamau.
He nāwaliwali hoʻi ko lāua pilina.ʻAʻole pale wela nā mea hoʻopili polyester.Ua hōʻano hou ʻia lākou.Hāʻawi kēia iā lākou me ka pale wela.Hoʻoikaika pū kēia hoʻololi i ka hoʻololi.Mālama kēia iā lākou i ka hui PCB multilayer.
ʻO nā mea hoʻopili Acrylic
ʻOi aku kēia mau mea hoʻopili.Loaʻa iā lākou ke kūpaʻa wela maikaʻi e kūʻē i ka corrosion a me nā kemika.He maʻalahi lākou e hoʻohana a maʻalahi ka uku.Hoʻohuiʻia me ko lākou loaʻa, kaulana lākou i waena o nā mea hana.nā mea hana.
ʻO nā epoxies
ʻO kēia paha ka mea hoʻopili i hoʻohana nui ʻia i ka hana kaapuni rigid-flex.Hiki iā lākou ke pale i ka corrosion a me nā wela kiʻekiʻe a haʻahaʻa.
Hiki ke hoʻololi a paʻa paʻa lākou.Loaʻa iā ia kahi polyester liʻiliʻi i loko o ia mea e ʻoi aku ka maʻalahi.
Hoʻopaʻa
ʻO ka hoʻopaʻa ʻana o rigid-ex PCB kekahi o nā ʻāpana nui i ka wā
rigid-ex PCB fabrication a ʻoi aku ka paʻakikī ma mua o ka maʻamau
nā papa ʻoʻoleʻa, e nānā kākou i 4 mau papa o rigid-ex PCB e like me lalo.
luna solder mask
Papa luna
Dielectric 1
Papa hōʻailona 1
Dielectric 3
Papa hōʻailona 2
Dielectric 2
Papa lalo
Soldermask lalo
Ka nui o ka PCB
| Kaha papa ʻoʻoleʻa | |
| Ka helu o nā papa: | 1-42 papa |
| Material: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers |
| Ka mānoanoa o waho Cu: | 1-6OZ |
| ʻO ka mānoanoa Cu ka mānoanoa o loko: | 1-4OZ |
| ʻāpana hana kiʻekiʻe loa: | 610*1100mm |
| Mānoanoa papa liʻiliʻi: | 2 papa 0.3mm (12mil) 4 papa 0.4mm (16mil) 6 papa 0.8mm (32mil) 8 papa 1.0mm (40mil) 10 papa 1.1mm (44mil) 12 papa 1.3mm (52mil) 14 papa 1.5mm (59mil) 16 papa 1.6mm (63mil) |
| Laulā liʻiliʻi: | 0.076mm (3mil) |
| Wahi liʻiliʻi loa: | 0.076mm (3mil) |
| Ka nui o ka puka liʻiliʻi (puka hope): | 0.2mm |
| Lakiō hiʻohiʻona: | 10:1 |
| Ka nui o ka lua wili: | 0.2-0.65mm |
| ʻO ka hoʻomanawanui wili ʻana: | +\-0.05mm(2mil) |
| PTH hoʻomanawanui: | Φ0.2-1.6mm +\-0.075mm (3mil) Φ1.6-6.3mm+\-0.1mm(4mil) |
| NPTH hoʻomanawanui: | Φ0.2-1.6mm +\-0.05mm(2mil) Φ1.6-6.3mm+\-0.05mm(2mil) |
| Hoʻopau papa hoʻomanawanui: | Mānoanoa ＜0.8mm, Hoʻomanawanui:+/-0.08mm |
| 0.8mm≤Thickness≤6.5mm,Hoʻomanawanui+/-10% | |
| Alahaka soldermask liʻiliʻi: | 0.076mm (3mil) |
| ʻO ka wili a me ka piko: | ≤0.75% Min0.5% |
| Raneg o TG: | 130-215 ℃ |
| Ka hoʻomanawanui impedance: | +/-10%，Min+/-5% |
| Lapaʻau ʻili: | HASL, LF HASL |
| Gula Kaiapuni, gula Flash, manamana gula | |
| Kālā Immersion, Tin Immersion, OSP | |
| Kāleka gula koho, mānoanoa gula a hiki i 3um(120u”) | |
| Paʻi Kalapona, Peelable S/M, ENEPIG | |
| Kaha papa alumini | |
| Ka helu o nā papa: | Papa hoʻokahi, papa ʻelua |
| Nui ka nui o ka papa: | 1500*600mm |
| Mānoanoa papa: | 0.5-3.0mm |
| Ka mānoanoa keleawe: | 0.5-4oz |
| Ka nui o ka puka liʻiliʻi: | 0.8mm |
| laula liʻiliʻi: | 0.1mm |
| wahi liʻiliʻi loa: | 0.12mm |
| Ka nui o ka papa liʻiliʻi: | 10 micron |
| Pau ʻili: | HASL, OSP, ENIG |
| Hana ʻana: | CNC, Kuʻi, V-ʻoki |
| Mea lako: | Mea hoʻokolo honua |
| ʻO ka ʻimi lele ʻana i ka wehe/ka mea hōʻike pōkole | |
| Microscope mana kiʻekiʻe | |
| Kiko ho'āʻo Solderability | |
| Mea ho'āʻo ikaika Peel | |
| High Volt Open & Pōkole hōʻike | |
| Kea Pauku Molding Kit Me ka Polisher | |
| Kaha FPC | |
| Nā ʻāpana: | 1-8 papa |
| Mānoanoa papa: | 0.05-0.5mm |
| Ka mānoanoa keleawe: | 0.5-3OZ |
| Laulā liʻiliʻi: | 0.075mm |
| wahi liʻiliʻi loa: | 0.075mm |
| Ka nui o loko o ka puka: | 0.2mm |
| Ka nui o ka puka laser liʻiliʻi: | 0.075mm |
| Ka liʻiliʻi loa o ka puka kuʻi: | 0.5mm |
| ʻO ke ahonui Soldermask: | +\-0.5mm |
| ʻO ka liʻiliʻi o ka ʻae ʻana i ke ana ʻana: | +\-0.5mm |
| Pau ʻili: | HASL,LF HASL, Kālā Kaiapuni, Gula Kaiapuni, Gula Flash, OSP |
| Hana ʻana: | Kuʻi, Laser, ʻoki |
| Mea lako: | Mea hoʻokolo honua |
| ʻO ka ʻimi lele ʻana i ka wehe/ka mea hōʻike pōkole | |
| Microscope mana kiʻekiʻe | |
| Kiko ho'āʻo Solderability | |
| Mea ho'āʻo ikaika Peel | |
| High Volt Open & Pōkole hōʻike | |
| Kea Pauku Molding Kit Me ka Polisher | |
| ʻO ka mana ʻoi aʻe | |
| Nā ʻāpana: | 1-28 papa |
| ʻAno mea: | FR-4(Kiʻekiʻe Tg, Halogen Free, Kiʻekiʻe alapinepine) PTFE, BT, Getek, Aluminum base，Copper base，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Mānoanoa papa: | 6-240mil/0.15-6.0mm |
| Ka mānoanoa keleawe: | 210um (6oz) no ka papa loko 210um (6oz) no ka papa waho |
| ʻO ka nui o ka drill mechanical min: | 0.2mm/0.08” |
| Lakiō hiʻohiʻona: | 2:1 |
| Nui ka nui o ka panel: | ʻO ka ʻaoʻao Sigle a i ʻole ʻaoʻao pālua: 500mm * 1200mm |
| Nā ʻāpana ʻāpana he nui: 508mm X 610mm (20″ X 24″) | |
| Min laula laina/wāwae: | 0.076mm / 0.076mm (0.003″ / 0.003″)/ 3mil/3mil |
| Via ʻano puka: | Makapō / Kanu / Hoʻopili (VOP, VIP…) |
| HDI / Microvia: | ʻAE |
| Pau ʻili: | HASL, LF HASL |
| Gula Kaiapuni, gula Flash, manamana gula | |
| Kālā Immersion, Tin Immersion, OSP | |
| Kāleka gula koho, mānoanoa gula a hiki i 3um(120u”) | |
| Paʻi Kalapona, Peelable S/M, ENEPIG | |
| Hana ʻana: | CNC, Kuʻi, V-ʻoki |
| Mea lako: | Mea hoʻokolo honua |
| ʻO ka ʻimi lele ʻana i ka wehe/ka mea hōʻike pōkole | |
| Microscope mana kiʻekiʻe | |
| Kiko ho'āʻo Solderability | |
| Mea ho'āʻo ikaika Peel | |
| High Volt Open & Pōkole hōʻike | |
| Kea Pauku Molding Kit Me ka Polisher | |
