Nā huahana
Naʻauao akamai 8 papa pcb me vais i ka ʻenehana pad
| Nā ʻāpana | 8 papa |
| Mānoanoa papa | 1.60MM |
| Mea waiwai | FR4 tg170 |
| Ka mānoanoa keleawe | 1/1/1/1/1/1/1/1 OZ(35um) |
| Hoʻopau ʻili | ENIG Au Mānoanoa 0.05um;Ni Mānoanoa 3um |
| Puka min(mm) | 0.203mm piha me ka resin |
| Laina Laina min (mm) | 0.13mm |
| Mokuna laina min(mm) | 0.13mm |
| Palekana Solder | ʻōmaʻomaʻo |
| Kala Kaao | Keʻokeʻo |
| Ka hana mīkini | V-scoring, CNC Milling (alanui) |
| Hoʻopili | ʻeke anti-static |
| E-hoʻāʻo | ʻO ka ʻimi lele ʻana a i ʻole ka mea paʻa |
| Kūlana ʻae | IPC-A-600H Papa 2 |
| Palapala noi | Mea uila kaʻa |
Mea Huahana
Ma keʻano he mea hoʻolako i nāʻenehana PCB likeʻole, nā puke, nā koho manawa alakaʻi, loaʻa iā mākou kahi koho o nā mea maʻamau me kahi bandwidth nui o nāʻano likeʻole o ka PCB hiki ke uhiʻia a loaʻa mau i ka hale.
Hiki ke hoʻokō ʻia nā koi no nā mea ʻē aʻe a i ʻole nā mea kūikawā i ka nui o nā hihia, akā, ma muli o nā koi pololei, a hiki i kahi 10 mau lā hana e pono ai ke kūʻai i ka mea.
E hui pū me mākou a kūkākūkā i kāu mau pono me kekahi o kā mākou kūʻai a i ʻole hui CAM.
Nā mea maʻamau i mālama ʻia i ka waihona:
| Nā ʻāpana | mānoanoa | Hoʻomanawanui | ʻAno ulana |
| Nā papa loko | 0,05mm | +/-10% | 106 |
| Nā papa loko | 0.10mm | +/-10% | 2116 |
| Nā papa loko | 0,13mm | +/-10% | 1504 |
| Nā papa loko | 0,15mm | +/-10% | 1501 |
| Nā papa loko | 0.20mm | +/-10% | 7628 |
| Nā papa loko | 0,25mm | +/-10% | 2 x 1504 |
| Nā papa loko | 0.30mm | +/-10% | 2 x 1501 |
| Nā papa loko | 0.36mm | +/-10% | 2 x 7628 |
| Nā papa loko | 0,41mm | +/-10% | 2 x 7628 |
| Nā papa loko | 0,51mm | +/-10% | 3 x 7628/2116 |
| Nā papa loko | 0,61mm | +/-10% | 3 x 7628 |
| Nā papa loko | 0.71mm | +/-10% | 4 x 7628 |
| Nā papa loko | 0,80mm | +/-10% | 4 x 7628/1080 |
| Nā papa loko | 1,0mm | +/-10% | 5 x7628/2116 |
| Nā papa loko | 1,2mm | +/-10% | 6 x7628/2116 |
| Nā papa loko | 1,55mm | +/-10% | 8 x7628 |
| Prepregs | 0.058mm* | Pili i ka hoʻolālā | 106 |
| Prepregs | 0.084mm* | Pili i ka hoʻolālā | 1080 |
| Prepregs | 0.112mm* | Pili i ka hoʻolālā | 2116 |
| Prepregs | 0.205mm* | Pili i ka hoʻolālā | 7628 |
ʻO ka mānoanoa Cu no nā papa o loko: Kūlana - 18µm a me 35 µm,
ma ke noi 70 µm, 105µm a me 140µm
ʻAno mea: FR4
Tg: ma kahi o.150°C, 170°C, 180°C
εr ma 1 MHz: ≤5,4 (maʻamau: 4,7) Loaʻa hou aku ma ke noi
Hoʻopili
He 8 papa PCB stackup he 8 PCB papa.
Loaʻa iā ia nā papa hōʻailona waho a me loko a he nui nā papa ma loko o ia mea e pale ai i ka crosstalk hōʻailona.
ʻO nā papa o 8 layer PCB stackup penei:
· Mea hoʻokani pila
ʻO ka mea pale silika
· Mea hoʻopili huna
· Kiʻekiʻe-wikiwiki signallayer
· Papa hōʻailona
· Lanakila
· Papa honua
Aia he 7 papa o ka dielectric e hoʻohui i ʻehā mau mokulele honua i ʻehā papa hōʻailona.
