Nā huahana
Copper base Metal core pcb no ka ʻōnaehana hōʻike waho
He 2 papa kēiakumu keleawePCB nokukuiʻoihana.ʻO ka Papa Kaapuni Paʻi Paʻi Metala (MCPCB), a i ʻole PCB wela, he ʻano PCB i loaʻa kahi mea metala ma ke kumu no ka ʻāpana hoʻolaha wela o ka papa.
UL hōʻoiaMea kumu keleawe, 3/3OZ(105um) mānoanoa keleawe, ENIG Au Mānoanoa0.8um;Ni Mānoanoa 3um.Ka palena iki ma o 0.203 mmpiha me ka resin.
| Nā ʻāpana | 2nā papa |
| Mānoanoa papa | 3.2MM |
| Mea waiwai | Kumu keleawe |
| Ka mānoanoa keleawe | 3/3OZ(105um) |
| Hoʻopau ʻili | ENIG Au Manoanoa0.8um;Ni Mānoanoa 3um |
| Puka min(mm) | 0.3mm |
| Laina Laina min (mm) | 0.2mm |
| Mokuna laina min(mm) | 0.2mm |
| Palekana Solder | ʻeleʻele |
| Kala Kaao | Keʻokeʻo |
| Ka hana mīkini | V-scoring, CNC Milling (alanui) |
| Hoʻopili | ʻeke anti-static |
| E-hoʻāʻo | ʻO ka ʻimi lele ʻana a i ʻole ka mea paʻa |
| Kūlana ʻae | IPC-A-600H Papa 2 |
| Palapala noi | Mea uila kaʻa |
Metal Core PCB a i ʻole MCPCB
ʻIke ʻia ʻo Metal Core PCB (MCPCB) ʻo Metal Backplane PCB a i ʻole Thermal PCB.Hoʻohana kēia ʻano PCB i kahi mea metala ma kahi o ka FR4 maʻamau no kona kumu, ka ʻāpana wela o ka papa.
As ua ikeiaHoʻokumu ʻia ka wela ma ka papa no kekahi kumu i nā mea uila i ka wā e hana ai.Hoʻoili ka metala i ka wela mai ka papa kaapuni a hoʻihoʻi hou iā ia i ke kumu metala a i ʻole ke kākoʻo wela metala a me ka Element savings kī.
Ma kahi PCB multilayer e ʻike ʻoe i kahi helu like o nā papa i puʻunaue ʻia ma ka ʻaoʻao kumu metala.No ka laʻana, inā ʻoe e nānā Ma kahi PCB 12-layer, e ʻike ʻoe i ʻeono papa ma luna a me ʻeono papa ma lalo, ma ka waena ke kumu metala.
MCPCB a i ʻole Metal Core PCB Ua ʻike ʻia ʻo ICPB a i ʻole PCB Metal Insulated, IMS a i ʻole Insulated Metal Substrates, Metal Clad PCBs a me Thermal Clad PCBs.
Fa i ʻole ʻoe No ka hoʻomaopopo maikaʻi ʻana e hoʻohana wale mākou i ka huaʻōlelo metala PCB ma loko o kēia ʻatikala.
ʻO ke ʻano kumu o kahi PCB metala me kēia mau mea:
Lae keleawe – 1oz.a 6oz.(ʻo ka mea maʻamau ka 1oz a i ʻole 2oz)
papa kaapuni
Papa dielectric
Māka solder
ʻO ka wela a i ʻole ka wela wela (metala kumu kumu)
Pono no ka MCPCB
ʻO ka hoʻoili wela
ʻAʻole maikaʻi ʻo CEM3 a i ʻole FR4 i ka lawe ʻana i ka wela.ina wela
ʻO nā substrate i hoʻohana ʻia i nā PCB he maikaʻi ʻole ka conductivity a hiki ke hōʻino i nā ʻāpana o ka papa PCB.ʻO ia ka manawa e hiki mai ai nā PCB metala.
Loaʻa i ka MCPCB ka conductivity wela maikaʻi e pale i nā ʻāpana mai ka pōʻino.
Hʻai hoʻopau
Hāʻawi ia i ka mana hoʻomaha maikaʻi.Hiki i nā PCB metala ke hoʻopau i ka wela mai kahi IC me ka maikaʻi loa.A laila, hoʻololi ka papa hana thermally i ka wela i ka substrate metala.
Paʻa unahi
Hāʻawi ia i ke kūpaʻa kiʻekiʻe ma mua o nā ʻano PCB ʻē aʻe.Ma hope o ka hoʻololi ʻana o ka mahana mai 30 degere Celsius a 140-150 degere Celsius, ʻo ka hoʻololi ʻana o ka nui o ka metala alumini he 2.5 ~ 3%.
Reduce distortion
No ka mea, ʻoi aku ka maikaʻi o ka hoʻoheheʻe ʻana o ka wela a me ka conductivity thermal i nā PCB metala, ʻoi aku ka liʻiliʻi o ka deformation ma muli o ka wela i hoʻokomo ʻia.Ma muli o kēia ʻano o ke kumu metala, ʻo nā PCB ka koho mua no nā noi lako mana e koi ai i ka hoʻololi kiʻekiʻe.
